SEPARATION AGREEMENT AND RELEASESeparation Agreement • February 23rd, 2012 • Spansion Inc. • Semiconductors & related devices • California
Contract Type FiledFebruary 23rd, 2012 Company Industry JurisdictionThis Separation Agreement and Release (“Agreement”) is made by and between Ahmed Nawaz (“Executive”) and Spansion Inc. (the “Company”) (collectively referred to as the “Parties” or individually referred to as a “Party”).
SEPARATION AGREEMENT AND RELEASESeparation Agreement • August 5th, 2011 • Spansion Inc. • Semiconductors & related devices • California
Contract Type FiledAugust 5th, 2011 Company Industry JurisdictionThis Separation Agreement and Release (“Agreement”) is made by and between James P. Reid (“Executive”) and Spansion Inc. (the “Company”) (collectively referred to as the “Parties” or individually referred to as a “Party”).