AMENDMENT NO. 3 TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • May 14th, 2020 • Transphorm, Inc. • Semiconductors & related devices
Contract Type FiledMay 14th, 2020 Company IndustryThis Amendment No. 3 to Loan and Security Agreement, dated as of April 8th, 2020 (this “Amendment”), is entered into by and between Nexperia B.V., a private limited liability company incorporated under the laws of the Netherlands, with its registered office at Jonkerbosplein 52, 6534 AB Nijmegen, the Netherlands (“Nexperia” or the “Lender”), and Transphorm Technology, Inc. (f/k/a Transphorm, Inc.), a Delaware corporation (“Transphorm” or the “Borrower”), and amends that certain Loan and Security Agreement, dated as of April 4, 2018, as previously amended by Amendment No. 1 to Loan and Security Agreement dated March 21, 2019, and by Amendment No. 2 to Loan and Security Agreement dated as of February 7th, 2020 (such Loan and Security Agreement as amended by Amendment No. 1 and Amendment No. 2, collectively, the “Loan and Security Agreement”). Capitalized terms used herein but not defined herein are used as defined in the Loan and Security Agreement.
AMENDMENT NO. 4 TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • May 14th, 2020 • Transphorm, Inc. • Semiconductors & related devices
Contract Type FiledMay 14th, 2020 Company IndustryThis Amendment No. 4 to Loan and Security Agreement, dated as of April 28th, 2020 (this “Amendment”), is entered into by and between Nexperia B.V., a private limited liability company incorporated under the laws of the Netherlands, with its registered office at Jonkerbosplein 52, 6534 AB Nijmegen, the Netherlands (“Nexperia” or the “Lender”), and Transphorm Technology, Inc. (f/k/a Transphorm, Inc.), a Delaware corporation (“Transphorm” or the “Borrower”), and amends that certain Loan and Security Agreement, dated as of April 4, 2018, as previously amended by Amendment No. 1 to Loan and Security Agreement dated March 21, 2019, by Amendment No. 2 to Loan and Security Agreement dated as of February 7th, 2020 and by Amendment No.3 to Loan and Security Agreement dated as of April 8th, 2020 (such Loan and Security Agreement as amended by Amendment No. 1, Amendment No. 2 and Amendment No. 3, collectively, the “Loan and Security Agreement”). Capitalized terms used herein but not defined herein
AMENDMENT NO. 4 TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • May 7th, 2020 • Transphorm, Inc. • Semiconductors & related devices
Contract Type FiledMay 7th, 2020 Company IndustryThis Amendment No. 4 to Loan and Security Agreement, dated as of April 28th, 2020 (this “Amendment”), is entered into by and between Nexperia B.V., a private limited liability company incorporated under the laws of the Netherlands, with its registered office at Jonkerbosplein 52, 6534 AB Nijmegen, the Netherlands (“Nexperia” or the “Lender”), and Transphorm Technology, Inc. (f/k/a Transphorm, Inc.), a Delaware corporation (“Transphorm” or the “Borrower”), and amends that certain Loan and Security Agreement, dated as of April 4, 2018, as previously amended by Amendment No. 1 to Loan and Security Agreement dated March 21, 2019, by Amendment No. 2 to Loan and Security Agreement dated as of February 7th, 2020 and by Amendment No.3 to Loan and Security Agreement dated as of April 8th, 2020 (such Loan and Security Agreement as amended by Amendment No. 1, Amendment No. 2 and Amendment No. 3, collectively, the “Loan and Security Agreement”). Capitalized terms used herein but not defined herein
AMENDMENT NO. 3 TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • May 7th, 2020 • Transphorm, Inc. • Semiconductors & related devices
Contract Type FiledMay 7th, 2020 Company IndustryThis Amendment No. 3 to Loan and Security Agreement, dated as of April 8th, 2020 (this “Amendment”), is entered into by and between Nexperia B.V., a private limited liability company incorporated under the laws of the Netherlands, with its registered office at Jonkerbosplein 52, 6534 AB Nijmegen, the Netherlands (“Nexperia” or the “Lender”), and Transphorm Technology, Inc. (f/k/a Transphorm, Inc.), a Delaware corporation (“Transphorm” or the “Borrower”), and amends that certain Loan and Security Agreement, dated as of April 4, 2018, as previously amended by Amendment No. 1 to Loan and Security Agreement dated March 21, 2019, and by Amendment No. 2 to Loan and Security Agreement dated as of February 7th, 2020 (such Loan and Security Agreement as amended by Amendment No. 1 and Amendment No. 2, collectively, the “Loan and Security Agreement”). Capitalized terms used herein but not defined herein are used as defined in the Loan and Security Agreement.