VOTING AGREEMENT among ST ASSEMBLY TEST SERVICES LTD and the STOCKHOLDERS OF CHIPPAC, INC. identified on the signature pages hereto Dated as of February 10, 2004Voting Agreement • February 23rd, 2004 • Chippac Inc • Semiconductors & related devices • Delaware
Contract Type FiledFebruary 23rd, 2004 Company Industry JurisdictionVOTING AGREEMENT, dated as of February 10, 2004 (this “Agreement”), among ST ASSEMBLY TEST SERVICES LTD, a Singapore public company limited by shares (“Parent”), and the stockholders (each a “Stockholder”) of ChipPAC, Inc., a Delaware corporation (the “Company”), identified on the signature pages hereto.
VOTING AGREEMENT among ST ASSEMBLY TEST SERVICES LTD and the STOCKHOLDERS OF CHIPPAC, INC. identified on the signature pages hereto Dated as of February 10, 2004Voting Agreement • February 20th, 2004 • Temasek Holdings LTD • Semiconductors & related devices • Delaware
Contract Type FiledFebruary 20th, 2004 Company Industry JurisdictionVOTING AGREEMENT, dated as of February 10, 2004 (this “Agreement”), among ST ASSEMBLY TEST SERVICES LTD, a Singapore public company limited by shares (“Parent”), and the stockholders (each a “Stockholder”) of ChipPAC, Inc., a Delaware corporation (the “Company”), identified on the signature pages hereto.