Common Contracts
2 similar Joinder Agreement contracts by Amkor Technology Inc
JOINDER AGREEMENTJoinder Agreement • May 18th, 2005 • Amkor Technology Inc • Semiconductors & related devices
This Joinder Agreement, dated as of May 12, 2005, is delivered pursuant to Section 7.10 (Additional Grantors) of the Second Lien Pledge and Security Agreement, dated as of October 27, 2004, by Amkor Technology, Inc. (the “Borrower”), Guardian Assets, Inc., Unitive, Inc., Unitive Electronics, Inc. and the other Subsidiaries of the Borrower from time to time party thereto as Grantors in favor of Citicorp North America, Inc., as agent for the Secured Parties referred to therein (the “Pledge and Security Agreement”). Capitalized terms used herein but not defined herein are used with the meanings given them in the Pledge and Security Agreement.
JOINDER AGREEMENTJoinder Agreement • May 18th, 2005 • Amkor Technology Inc • Semiconductors & related devices
This Joinder Agreement, dated as of May 12, 2005, is delivered pursuant to Section 7.10 (Additional Grantors) of the Pledge and Security Agreement, dated as of June 29, 2004, by Amkor Technology, Inc. (the “Borrower”), Guardian Assets, Inc. (“Guardian”) and the other Subsidiaries of the Borrower from time to time party thereto as Grantors in favor of Citicorp North America, Inc., as agent for the Secured Parties referred to therein, as amended by Amendment No. 1 to the Pledge and Security Agreement, dated as of October 27, 2004, by the Borrower, Guardian, Unitive, Inc., Unitive Electronics, Inc. and the other Subsidiaries of the Borrower from time to time party thereto as Grantors in favor of Citicorp North America, Inc., as agent for the Secured Parties referred to therein (as amended, the "Pledge and Security Agreement”). Capitalized terms used herein but not defined herein are used with the meanings given them in the Pledge and Security Agreement.
