ContractIndemnification & Liability • January 14th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 14th, 2002 Company Industry JurisdictionINDEMNITY, SUBROGATION and CONTRIBUTION AGREEMENT dated as of December 21, 2001, among MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation (the "Borrower"), each subsidiary of Borrower listed on Schedule I hereto (each such subsidiary individually, a "Subsidiary" and or a "Guarantor" and, collectively, the "Guarantors") and CITICORP USA, INC., as collateral agent (in such capacity, the "Collateral Agent") for the Secured Parties (as defined in the Security Agreement).
ContractIndemnification & Liability • November 28th, 2001 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledNovember 28th, 2001 Company Industry JurisdictionINDEMNITY, SUBROGATION and CONTRIBUTION AGREEMENT dated as of November 13, 2001, among MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation (the "Borrower"), each subsidiary of Borrower listed on Schedule I hereto (each such subsidiary individually, a "Subsidiary" and or a "Guarantor" and, collectively, the "Guarantors") and CITICORP USA, INC., as collateral agent (in such capacity, the "Collateral Agent") for the Secured Parties (as defined in the Security Agreement).