Common Contracts
3 similar Letter of Credit Facility Agreement contracts by Sunpower Corp
LETTER OF CREDIT FACILITY AGREEMENT dated as of June 29, 2016 among SUNPOWER CORPORATION, SUNPOWER CORPORATION, SYSTEMS, TOTAL S.A., the SUBSIDIARY APPLICANTS parties hereto from time to time, and CRÉDIT AGRICOLE CORPORATE AND INVESTMENT BANKLetter of Credit Facility Agreement • August 10th, 2016 • Sunpower Corp • Semiconductors & related devices • New York
This LETTER OF CREDIT FACILITY AGREEMENT (this “Agreement”) dated as of June 29, 2016, is made by and among SunPower Corporation, a Delaware corporation (the “Company”), SunPower Corporation, Systems, a Delaware corporation (“Systems”), Total S.A., a société anonyme organized under the laws of the Republic of France (the “Parent Guarantor”), the Subsidiary Applicants (as defined below) parties hereto from time to time, and Crédit Agricole Corporate and Investment Bank (the “Bank”).
LETTER OF CREDIT FACILITY AGREEMENT dated as of June 29, 2016 among SUNPOWER CORPORATION, SUNPOWER CORPORATION, SYSTEMS, TOTAL S.A., the SUBSIDIARY APPLICANTS parties hereto from time to time, and HSBC BANK USA, NATIONAL ASSOCIATIONLetter of Credit Facility Agreement • August 10th, 2016 • Sunpower Corp • Semiconductors & related devices • New York
This LETTER OF CREDIT FACILITY AGREEMENT (this “Agreement”) dated as of June 29, 2016, is made by and among SunPower Corporation, a Delaware corporation (the “Company”), SunPower Corporation, Systems, a Delaware corporation (“Systems”), Total S.A., a société anonyme organized under the laws of the Republic of France (the “Parent Guarantor”), the Subsidiary Applicants parties hereto from time to time, and HSBC Bank USA, National Association (the “Bank”).
LETTER OF CREDIT FACILITY AGREEMENT dated as of June 29, 2016 among SUNPOWER CORPORATION, SUNPOWER CORPORATION, SYSTEMS, TOTAL S.A., the SUBSIDIARY APPLICANTS parties hereto from time to time, and THE BANK OF TOKYO-MITSUBISHI UFJ, LTD.Letter of Credit Facility Agreement • August 10th, 2016 • Sunpower Corp • Semiconductors & related devices • New York
This LETTER OF CREDIT FACILITY AGREEMENT (this “Agreement”) dated as of June 29, 2016 is made by and among SunPower Corporation, a Delaware corporation (the “Company”), SunPower Corporation, Systems, a Delaware corporation (“Systems”), Total S.A., a société anonyme organized under the laws of the Republic of France (the “Parent Guarantor”), the Subsidiary Applicants parties hereto from time to time, and The Bank of Tokyo-Mitsubishi UFJ, Ltd. (acting out of any of its branches, the “Bank”).
