EXTENSION AGREEMENTExtension Agreement • February 1st, 2024 • Sunpower Corp • Semiconductors & related devices
Contract Type FiledFebruary 1st, 2024 Company IndustryTHIS EXTENSION AGREEMENT, dated as of January 31, 2024 (this “Agreement”), by and among the undersigned Lenders and L/C Issuers, SUNPOWER CORPORATION, a Delaware corporation (the “Borrower”), the Subsidiary Guarantors party hereto, and BANK OF AMERICA, N.A., as Administrative Agent and the Swingline Lender.
EXTENSION AGREEMENTExtension Agreement • January 19th, 2024 • Sunpower Corp • Semiconductors & related devices
Contract Type FiledJanuary 19th, 2024 Company IndustryTHIS EXTENSION AGREEMENT, dated as of January 18, 2024 (this “Agreement”), by and among the undersigned Lenders and L/C Issuers, SUNPOWER CORPORATION, a Delaware corporation (the “Borrower”), the Subsidiary Guarantors party hereto, and BANK OF AMERICA, N.A., as Administrative Agent and the Swingline Lender.