CREDIT AGREEMENT DATED 16 NOVEMBER 2009 AS AMENDED AND RESTATED ON 30 MARCH 2010 US$582,500,000 CREDIT FACILITY FOR THE COMPANIES LISTED IN SCHEDULE 1 HEREIN as Borrowers COORDINATED BY THE HONGKONG AND SHANGHAI BANKING CORPORATION LIMITED WITH THE...Credit Agreement • August 5th, 2010 • TTM Technologies Inc • Printed circuit boards • Hong Kong
Contract Type FiledAugust 5th, 2010 Company Industry Jurisdiction
CREDIT AGREEMENT DATED 16 NOVEMBER 2009 US$582,500,000 CREDIT FACILITY FOR THE COMPANIES LISTED IN SCHEDULE 1 HEREIN as Borrowers COORDINATED BY THE HONGKONG AND SHANGHAI BANKING CORPORATION LIMITED WITH THE HONGKONG AND SHANGHAI BANKING CORPORATION...Credit Agreement • April 13th, 2010 • TTM Technologies Inc • Printed circuit boards • Hong Kong
Contract Type FiledApril 13th, 2010 Company Industry Jurisdiction