Common Contracts

LOAN AGREEMENT

Loan Agreement • March 31st, 2011 • Master Silicon Carbide Industries, Inc. • Semiconductors & related devices • New York

• Contract Type
  Loan Agreement
• Filed
  March 31st, 2011
• Company
  Master Silicon Carbide Industries, Inc.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

AGREEMENT made on this 14th day of April, 2010, by and between China Silicon Corporation, a Delaware corporation (“Debtor”) and Master Silicon Carbide Industries, Inc., a Nevada corporation (“Creditor”). All references to Creditor herein shall also refer to Creditor’s permitted assignees under this Agreement.

LOAN AGREEMENT

Loan Agreement • March 31st, 2010 • Master Silicon Carbide Industries, Inc. • Semiconductors & related devices • New York

• Contract Type
  Loan Agreement
• Filed
  March 31st, 2010
• Company
  Master Silicon Carbide Industries, Inc.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

AGREEMENT made on this 10th day of February, 2010, by and between China Silicon Corporation, a Delaware corporation (“Debtor”) and Master Silicon Carbide Industries, Inc., a Nevada corporation (“Creditor”). All references to Creditor herein shall also refer to Creditor’s permitted assignees under this Agreement.