Common Contracts
4 similar Merger Agreement contracts by BigBand Networks, Inc., Cypress Semiconductor Corp /De/, Graftech International LTD, Simtek Corp
AGREEMENT AND PLAN OF MERGER by and among BCP IV GRAFTECH HOLDINGS LP, ATHENA ACQUISITION SUBSIDIARY INC. and GRAFTECH INTERNATIONAL LTD. Dated as of May 17, 2015Merger Agreement • May 18th, 2015 • Graftech International LTD • Electrical industrial apparatus • Delaware
THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of May 17, 2015 by and among BCP IV GrafTech Holdings LP, a Delaware limited partnership (“Parent”), Athena Acquisition Subsidiary Inc., a Delaware corporation and a wholly owned subsidiary of Parent (“Acquisition Sub”), and GrafTech International Ltd., a Delaware corporation (the “Company”).
AGREEMENT AND PLAN OF MERGERMerger Agreement • October 11th, 2011 • BigBand Networks, Inc. • Radio & tv broadcasting & communications equipment • Delaware
THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of October 10, 2011 by and among ARRIS GROUP, INC., a Delaware corporation (“Parent”), AMSTERDAM ACQUISITION SUB, INC., a Delaware corporation and a wholly-owned subsidiary of Parent (“Acquisition Sub”), and BIGBAND NETWORKS, INC., a Delaware corporation (the “Company”).
AGREEMENT AND PLAN OF MERGERMerger Agreement • August 4th, 2008 • Cypress Semiconductor Corp /De/ • Semiconductors & related devices • Delaware
Furthermore, Acquisition Sub shall not be required to accept for payment, and (subject to the rules and regulations of the SEC) shall not be obligated to pay for, any Company Shares tendered pursuant to the Offer (and not theretofore accepted for payment or paid for) if, upon the expiration of the Offer (as it may have been extended pursuant to Section 1.1(d) of the Agreement) and before acceptance of such Company Shares for payment, any of the following circumstances exists:
AGREEMENT AND PLAN OF MERGERMerger Agreement • August 4th, 2008 • Simtek Corp • Semiconductors & related devices • Delaware
THIS AGREEMENT AND PLAN OF MERGER (“Agreement”) is made and entered into as of August 1, 2008, by and among, CYPRESS SEMICONDUCTOR CORPORATION, a Delaware corporation (“Parent”); Copper Acquisition Corporation, a Delaware corporation and a wholly owned subsidiary of Parent (“Acquisition Sub”); and SIMTEK CORPORATION, a Delaware corporation (the “Company”). Certain capitalized terms used in this Agreement are defined in Exhibit A.
