CREDIT AGREEMENT Dated as of October 5, 2009 between MICROSEMI CORPORATION and BANK OF AMERICA, N.A.Credit Agreement • October 7th, 2009 • Microsemi Corp • Semiconductors & related devices • California
Contract Type FiledOctober 7th, 2009 Company Industry JurisdictionThis CREDIT AGREEMENT (“Agreement”) is entered into as of October 5, 2009 by and between MICROSEMI CORPORATION, a Delaware corporation (the “Borrower”), and BANK OF AMERICA, N.A. (the “Lender”).
CREDIT AGREEMENT Dated as of June 27, 2008 between TRIQUINT SEMICONDUCTOR, INC. and BANK OF AMERICA, N.A.Credit Agreement • July 1st, 2008 • Triquint Semiconductor Inc • Semiconductors & related devices • New York
Contract Type FiledJuly 1st, 2008 Company Industry JurisdictionThis CREDIT AGREEMENT (“Agreement”) is entered into as of June 27, 2008 by and between TriQuint Semiconductor, Inc., a Delaware corporation (the “Borrower”) and Bank of America, N.A. (the “Lender”).