Common Contracts

AGREEMENT AND PLAN OF MERGER by and among DAPHNE PARENT LLC DAPHNE MERGER SUB, INC. and

Merger Agreement • September 28th, 2023 • Chico's Fas, Inc. • Retail-women's clothing stores • Florida

• Contract Type
  Merger Agreement
• Filed
  September 28th, 2023
• Company
  Chico's Fas, Inc.
• Industry
  Retail-women's clothing stores
• Jurisdiction
  Florida

THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of September 27, 2023, by and among Daphne Parent LLC, a Delaware limited liability company (“Parent”), Daphne Merger Sub, Inc., a Florida corporation and wholly-owned subsidiary of Parent (“Merger Sub”, and together with Parent, the “Buyer Parties”), and Chico’s FAS, Inc., a Florida corporation (the “Company”). Each of the Company, Parent and Merger Sub is sometimes referred to as a “Party.” All capitalized terms that are used in this Agreement have the respective meanings given to them in Article I.

AGREEMENT AND PLAN OF MERGER by and among IVANTI, INC. OAHU MERGER SUB, INC. and MOBILEIRON, INC. Dated as of September 26, 2020

Merger Agreement • September 28th, 2020 • Mobileiron, Inc. • Services-prepackaged software • Delaware

• Contract Type
  Merger Agreement
• Filed
  September 28th, 2020
• Company
  Mobileiron, Inc.
• Industry
  Services-prepackaged software
• Jurisdiction
  Delaware

THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of September 26, 2020, by and among Ivanti, Inc., a Delaware corporation (“Parent”), Oahu Merger Sub, Inc., a Delaware corporation and a wholly owned subsidiary of Parent (“Merger Sub”), and MobileIron, Inc., a Delaware corporation (the “Company”). Each of Parent, Merger Sub and the Company are sometimes referred to as a “Party.” All capitalized terms that are used in this Agreement have the respective meanings given to them in Article I.

AGREEMENT AND PLAN OF MERGER among HELP/SYSTEMS, LLC, GRAIL MERGER SUB, INC., GLOBALSCAPE, INC., and, solely with respect to certain sections, HS PURCHASER, LLC, and HELP/SYSTEMS HOLDINGS, INC. Dated July 19, 2020

Merger Agreement • July 20th, 2020 • Globalscape Inc • Services-prepackaged software • Delaware

• Contract Type
  Merger Agreement
• Filed
  July 20th, 2020
• Company
  Globalscape Inc
• Industry
  Services-prepackaged software
• Jurisdiction
  Delaware

This Agreement and Plan of Merger (this “Agreement”) is dated July 19, 2020, among Help/Systems, LLC, a Delaware limited liability company (“Parent”), Grail Merger Sub, Inc., a Delaware corporation and a wholly owned subsidiary of Parent (“Merger Sub”), GlobalSCAPE, Inc., a Delaware corporation (the “Company”), and solely with respect to Sections 4.1, 4.2, 4.3, 4.7, 4.9, 6.4 and 6.5, HS Purchaser, LLC, a Delaware limited liability company (“HS Purchaser”), and Help/Systems Holdings, Inc., a Delaware corporation (“HS Holdings” and, together with HS Purchaser, each a “Borrower” and collectively, the “Borrowers”). Each of Parent, Merger Sub and the Company are sometimes referred to as a “Party.” All capitalized terms that are used in this Agreement have the meanings given to them in Article I.

AGREEMENT AND PLAN OF MERGER among ADESTO TECHNOLOGIES CORPORATION, CIRCUIT ACQUISITION CORPORATION and ECHELON CORPORATION Dated June 28, 2018

Merger Agreement • June 29th, 2018 • Echelon Corp • Computer communications equipment • Delaware

• Contract Type
  Merger Agreement
• Filed
  June 29th, 2018
• Company
  Echelon Corp
• Industry
  Computer communications equipment
• Jurisdiction
  Delaware

This agreement and plan of merger (this “Agreement”) is dated June 28, 2018 (the “Agreement Date”), among Adesto Technologies Corporation, a Delaware corporation (“Parent”), Circuit Acquisition Corporation, a Delaware corporation and a wholly owned subsidiary of Parent (“Merger Sub”), and Echelon Corporation, a Delaware corporation (the “Company”). Each of Parent, Merger Sub and the Company are sometimes referred to as a “Party.” All capitalized terms that are used in this Agreement have the meanings given to them in Article I.