Common Contracts

Contract

Credit Agreement • March 3rd, 2017 • SMART Global Holdings, Inc. • Semiconductors & related devices • New York

• Contract Type
  Credit Agreement
• Filed
  March 3rd, 2017
• Company
  SMART Global Holdings, Inc.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

FIRST REFINANCING AMENDMENT dated as of August 20, 2014 (this “Amendment”), to the Credit Agreement (as defined below) among SMART Modular Technologies (Global Holdings), Inc. (f.k.a. SMART Modular Technologies (Global Memory Holdings), Inc.), as Holdings (“Holdings”), SMART Modular Technologies (Global), Inc., as Parent Borrower (the “Parent Borrower”), SMART Modular Technologies, Inc., as Co-Borrower (the “Co-Borrower”; together with the Parent Borrower, the “Borrowers”), the New Revolving Lenders (as defined below) party hereto and JPMorgan Chase Bank, N.A., as Administrative Agent.

Contract

Credit Agreement • August 26th, 2014 • SMART Global Holdings, Inc. • Semiconductors & related devices • New York

• Contract Type
  Credit Agreement
• Filed
  August 26th, 2014
• Company
  SMART Global Holdings, Inc.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

FIRST REFINANCING AMENDMENT dated as of August 20, 2014 (this “Amendment”), to the Credit Agreement (as defined below) among SMART Modular Technologies (Global Holdings), Inc. (f.k.a. SMART Modular Technologies (Global Memory Holdings), Inc.), as Holdings (“Holdings”), SMART Modular Technologies (Global), Inc., as Parent Borrower (the “Parent Borrower”), SMART Modular Technologies, Inc., as Co-Borrower (the “Co-Borrower”; together with the Parent Borrower, the “Borrowers”), the New Revolving Lenders (as defined below) party hereto and JPMorgan Chase Bank, N.A., as Administrative Agent.