Common Contracts

AGREEMENT AND PLAN OF MERGER by and among CONCENTRIX CORPORATION, CONCENTRIX MERGER SUB INC. and SERVICESOURCE INTERNATIONAL, INC. Dated as of May 6, 2022 (Continued)

Agreement and Plan of Merger • May 9th, 2022 • Servicesource International, Inc. • Services-business services, nec • Delaware

• Contract Type
  Agreement and Plan of Merger
• Filed
  May 9th, 2022
• Company
  Servicesource International, Inc.
• Industry
  Services-business services, nec
• Jurisdiction
  Delaware

THIS AGREEMENT AND PLAN OF MERGER, dated as of May 6, 2022 (this “Agreement”), is made by and among Concentrix Corporation, a Delaware corporation (“Parent”), Concentrix Merger Sub Inc., a Delaware corporation and a direct, wholly owned Subsidiary of Parent (“Acquisition Sub”), and ServiceSource International, Inc., a Delaware corporation (the “Company”).

AGREEMENT AND PLAN OF MERGER BY AND AMONG BROADCOM CORPORATION I&N ACQUISITION CORP. AND NETLOGIC MICROSYSTEMS, INC. Dated as of September 11, 2011

Agreement and Plan of Merger • September 12th, 2011 • Broadcom Corp • Semiconductors & related devices • Delaware

• Contract Type
  Agreement and Plan of Merger
• Filed
  September 12th, 2011
• Company
  Broadcom Corp
• Industry
  Semiconductors & related devices
• Jurisdiction
  Delaware

This AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of September 11, 2011, by and among Broadcom Corporation, a California corporation (“Parent”), I&N Acquisition Corp., a Delaware corporation and direct wholly owned subsidiary of Parent (“Merger Sub”), and NetLogic Microsystems, Inc., a Delaware corporation (the “Company”). Certain terms used in this Agreement are defined in Section 8.4.

AGREEMENT AND PLAN OF MERGER by and among SIRENZA MICRODEVICES, INC. METRIC ACQUISITION CORPORATION and MICRO LINEAR CORPORATION Dated as of August 14, 2006

Agreement and Plan of Merger • August 17th, 2006 • Micro Linear Corp /Ca/ • Semiconductors & related devices • Delaware

• Contract Type
  Agreement and Plan of Merger
• Filed
  August 17th, 2006
• Company
  Micro Linear Corp /Ca/
• Industry
  Semiconductors & related devices
• Jurisdiction
  Delaware

THIS AGREEMENT AND PLAN OF MERGER (this “Agreement”) is made and entered into as of August 14, 2006 by and among Sirenza Microdevices, Inc., a Delaware corporation (“Parent”), Metric Acquisition Corporation, a Delaware corporation and a wholly-owned subsidiary of Parent (“Merger Sub”), and Micro Linear Corporation, a Delaware corporation (the “Company”). All capitalized terms used in this Agreement shall have the respective meanings ascribed thereto in Article I hereof.