Common Contracts
1 similar New Agreement contracts
New Agreement between PAC TECH and NSMATNew Agreement • February 12th, 2013
The new system will be introduced at the SEMICON KOREA 2013. PAC TECH’s Ultra SB² Platform is designed for solder ball transfer from 6” up to 12’’ wafers. The flexible concept offers automatic flux printing, solder ball transfer, inspection and optional reflow with PAC TECH’s innovative small footprint oven (RF200).
