EX-2.1 2 d617056dex21.htm EX-2.1 AGREEMENT AND PLAN OF MERGER by and between RENESAS ELECTRONICS CORPORATION and INTEGRATED DEVICE TECHNOLOGY, INC. dated as of September 10, 2018 Exhibit A Form of Joinder Agreement Exhibit B Form of FIRPTA Certificate...Merger Agreement • May 5th, 2020 • Delaware
Contract Type FiledMay 5th, 2020 JurisdictionThis AGREEMENT AND PLAN OF MERGER (hereinafter referred to as this “Agreement”), dated September 10, 2018, is by and between Renesas Electronics Corporation, a Japanese corporation (“Parent”), and Integrated Device Technology, Inc., a Delaware corporation (the “Company”). All capitalized terms used in this Agreement shall have the meanings ascribed to such terms in Section 9.5 or as otherwise defined elsewhere in this Agreement unless the context clearly provides otherwise. Parent and the Company are each sometimes referred to herein as a “Party” and collectively as the “Parties.”
AGREEMENT AND PLAN OF MERGER by and between RENESAS ELECTRONICS CORPORATION and INTEGRATED DEVICE TECHNOLOGY, INC. dated as of September 10, 2018Merger Agreement • September 11th, 2018 • Integrated Device Technology Inc • Semiconductors & related devices • Delaware
Contract Type FiledSeptember 11th, 2018 Company Industry JurisdictionThis AGREEMENT AND PLAN OF MERGER (hereinafter referred to as this “Agreement”), dated September 10, 2018, is by and between Renesas Electronics Corporation, a Japanese corporation (“Parent”), and Integrated Device Technology, Inc., a Delaware corporation (the “Company”). All capitalized terms used in this Agreement shall have the meanings ascribed to such terms in Section 9.5 or as otherwise defined elsewhere in this Agreement unless the context clearly provides otherwise. Parent and the Company are each sometimes referred to herein as a “Party” and collectively as the “Parties.”