Exhibit 10.2 June 30, 2003 Tegal Corporation 2201 South McDowell Blvd. Petaluma, CA 94954 Gentlemen: Reference is made to (i) the Loan and Security Agreement, and the Loan and Security Agreement (Exim Program), both between you ("Borrower") and us...Loan and Security Agreement • August 15th, 2003 • Tegal Corp /De/ • Special industry machinery, nec
Contract Type FiledAugust 15th, 2003 Company IndustryReference is made to (i) the Loan and Security Agreement, and the Loan and Security Agreement (Exim Program), both between you ("Borrower") and us ("Silicon"), and both dated as of June 26, 2002 (as amended, restated, supplemented, or otherwise modified from time to time, collectively the "Loan Agreements"), and (ii) the Schedule to Loan and Security Agreement, and the Schedule to Loan and Security Agreement (Exim Program), both between Borrower and Silicon, and both dated as of June 26, 2002 (as amended, restated, supplemented or otherwise modified from time to time, collectively the "Loan Agreement Schedules"). This letter agreement (this "Agreement"), the Loan Agreements, the Loan Agreement Schedules, and all other written documents and agreements between us are referred to herein collectively as the "Loan Documents". Capitalized terms used, but not defined, in this Agreement shall have the meanings set forth in the Loan Agreements and the Loan Agreement Schedules.
April 24, 2003Loan and Security Agreement • May 13th, 2003 • White Electronic Designs Corp • Semiconductors & related devices
Contract Type FiledMay 13th, 2003 Company IndustryRe: Loan and Security Agreement dated January 7, 2000 (as amended from time to time, the "Loan Agreement") between White Electronic Designs Corporation, an Indiana corporation ("Borrower"), and Bank One, NA, a national banking association with its main office in Chicago, Illinois, successor by merger to Bank One, Texas, N.A. ("Lender")