FORM OF INDEMNITY AGREEMENTForm of Indemnity Agreement • October 10th, 2008 • Advanced Micro Devices Inc • Semiconductors & related devices • Delaware
Contract Type FiledOctober 10th, 2008 Company Industry JurisdictionThis Indemnity Agreement (“Agreement”) is made as of by and between ADVANCED MICRO DEVICES, INC., a Delaware corporation (the “Company”), and (“Indemnitee”). This Agreement supersedes and replaces any and all previous agreements between the Company and Indemnitee covering the subject matter of this Agreement.
FORM OF INDEMNITY AGREEMENTForm of Indemnity Agreement • April 23rd, 2008 • Conceptus Inc • Surgical & medical instruments & apparatus • Delaware
Contract Type FiledApril 23rd, 2008 Company Industry JurisdictionThis Indemnity Agreement (“Agreement”) is made as of , 2008 by and between Conceptus, Inc., a Delaware corporation (the “Company”), and (“Indemnitee”).
FORM OF INDEMNITY AGREEMENTForm of Indemnity Agreement • October 21st, 2005 • Spansion Inc. • Semiconductors & related devices • Delaware
Contract Type FiledOctober 21st, 2005 Company Industry JurisdictionThis Indemnity Agreement (“Agreement”) is made as of , 2005 by and between Spansion, Inc., a Delaware corporation (the “Company”), and (“Indemnitee”).