LOAN AGREEMENTLoan Agreement • February 21st, 1997 • Elexsys International Inc • Printed circuit boards • New Hampshire
THIS TERM LOAN CREDIT AGREEMENT (the "Agreement") is made and entered into this 27th day of January, 1997 by and between SANWA BANK CALIFORNIA (the "Bank") and Elexsys International, Inc. (the "Borrower") in connection with that certain Accounts...Credit Agreement • February 21st, 1997 • Elexsys International Inc • Printed circuit boards • California
This Accounts Receivable Credit Agreement (the "Agreement") is made and entered into this 17th day of January, 1997, by and between SANWA BANK CALIFORNIA (the "Bank") and ELEXSYS INTERNATIONAL, INC. (the "Borrower"), in connection with that certain...Accounts Receivable Credit Agreement • February 21st, 1997 • Elexsys International Inc • Printed circuit boards • California
