0000743316-16-000075 Sample Contracts

CREDIT AGREEMENT dated as of June 23, 2016 among MAXIM HOLDING COMPANY LTD. and THE BANK OF TOKYO-MITSUBISHI UFJ, LTD., NEW YORK BRANCH as Lender
Credit Agreement • June 24th, 2016 • Maxim Integrated Products Inc • Semiconductors & related devices • New York
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GUARANTY
Guaranty • June 24th, 2016 • Maxim Integrated Products Inc • Semiconductors & related devices • New York

THIS GUARANTY (as amended, restated, replaced, supplemented or otherwise modified from time to time, this “Guaranty”) is executed as of June 23, 2016, by Maxim Integrated Products, Inc., a corporation duly organized under the laws of the state of Delaware, with offices at 160 Rio Robles, San Jose, California 95134 (“Guarantor”), in favor of The Bank of Tokyo-Mitsubishi UFJ Ltd., New York Branch, with offices at 1221 Avenue of the Americas, New York, New York 10020 (together with its branches, affiliates, offices, successors and assigns, the “Bank”).

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