CREDIT AGREEMENT Dated as of August 8, 2024 among QUALCOMM INCORPORATED, as Borrower, BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and an L/C Issuer, and The Other Lenders and L/C Issuers Party Hereto GOLDMAN SACHS BANK USA,...Credit Agreement • August 9th, 2024 • Qualcomm Inc/De • Radio & tv broadcasting & communications equipment • New York
This CREDIT AGREEMENT (this “Agreement”) is entered into as of August 8, 2024, among QUALCOMM INCORPORATED, a Delaware corporation (the “Borrower”), each lender from time to time party hereto (collectively, the “Lenders” and individually, a “Lender”), each L/C Issuer from time to time party hereto and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and an L/C Issuer.
