EMPLOYMENT AGREEMENTEmployment Agreement • January 8th, 2010 • Photronics Inc • Semiconductors & related devices • Connecticut
Contract Type FiledJanuary 8th, 2010 Company Industry JurisdictionTHIS EMPLOYMENT AGREEMENT (this "Agreement") is entered into as of February 20, 2003 by and between Photronics, Inc., a Connecticut corporation (the "Company"), having a principal place of business at 1061 East Indiantown Road, Jupiter, Florida 33477 and Sean T. Smith ("Executive") residing at 60 Whitney Ridge Terrace, North Haven, Connecticut, 06473.
RagingWire Telecommunications, INC. Master Services Agreement #1001.0.1Master Services Agreement • January 8th, 2010 • Photronics Inc • Semiconductors & related devices • California
Contract Type FiledJanuary 8th, 2010 Company Industry JurisdictionThis Master Services Agreement("Agreement") is entered into effective as of January 11, 2002, ("Effective Date") by and between RagingWire Telecommunications, Inc., a Nevada corporation ("RagingWire") and Photronics, Inc., a Florida corporation ("Customer"). In consideration of the mutual covenants contained in this Agreement, RagingWire and Customer agree as follows:
AMENDMENT NO. 2 Dated as of October 26, 2009 to LOAN AGREEMENT Dated as of June 8, 2009Loan Agreement • January 8th, 2010 • Photronics Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 8th, 2010 Company Industry JurisdictionTHIS AMENDMENT NO. 2 (“Amendment”) is made as of October 26, 2009 by and among Photronics, Inc. (the “Borrower”), the financial institutions listed on the signature pages hereof and JPMorgan Chase Bank, National Association, as Administrative Agent (in such capacity, the “Administrative Agent”) and as Collateral Agent (in such capacity, the “Collateral Agent”), under that certain Loan Agreement dated as of June 8, 2009 by and among the Borrower, the Lenders and the Administrative Agent (as amended by that certain Amendment No. 1 thereto, dated as of September 2, 2009, and as may be further amended, supplemented or otherwise modified from time to time, the “Loan Agreement”). Capitalized terms used herein and not otherwise defined herein shall have the respective meanings given to them in the Loan Agreement.
EXTENSION LETTER AGREEMENT TO EMPLOYMENT AGREEMENT CONFIDENTIAL January 6, 2010 Soo Hong Jeong #202 Sam-IK Park Villa 248 Gumi-Dong Bundang, Seongnam, Kyeonggi Korea 463-802 RE: Extension of your Employment Agreement Dear S.H.: Reference is made to...Extension Letter Agreement • January 8th, 2010 • Photronics Inc • Semiconductors & related devices
Contract Type FiledJanuary 8th, 2010 Company IndustryThis letter will amend your Agreement by renewing your Agreement for an additional period of one (1) year beginning on October 28, 2009 and ending on October 27, 2010. All other terms and conditions of the Agreement will remain the same.
AMENDMENT NO. 8 Dated as of October 26, 2009 to CREDIT AGREEMENT Dated as of June 6, 2007Credit Agreement • January 8th, 2010 • Photronics Inc • Semiconductors & related devices • New York
Contract Type FiledJanuary 8th, 2010 Company Industry JurisdictionTHIS AMENDMENT NO. 8 (“Amendment”) is made as of October 26, 2009 by and among Photronics, Inc. (the “Company”), the financial institutions listed on the signature pages hereof and JPMorgan Chase Bank, National Association, as Administrative Agent (in such capacity, the “Administrative Agent”) and as Collateral Agent (in such capacity, the “Collateral Agent”), under that certain Credit Agreement dated as of June 6, 2007 by and among the Company, the Lenders and the Administrative Agent (as amended by that certain Amendment No. 1 thereto, dated as of April 25, 2008, that certain Amendment No. 2 thereto, dated as of October 31, 2008, that certain Amendment No. 3 thereto, dated as of December 3, 2008, that certain Amendment No. 4 thereto, dated as of December 12, 2008, that certain Amendment No. 5 thereto, dated as of May 15, 2009, that certain Amendment No. 6 thereto, dated as of June 8, 2009, and that certain Amendment No. 7 thereto, dated as of September 2, 2009, and as may be further