0000867773-11-000062 Sample Contracts

SECURITY AGREEMENT (MMDA INVESTMENT OPTION)
Security Agreement • November 10th, 2011 • Sunpower Corp • Semiconductors & related devices • New York

SECURITY AGREEMENT dated as of September 27, 2011(this “Agreement”), among SUNPOWER CORPORATION, a Delaware corporation (“Grantor”), DEUTSCHE BANK TRUST COMPANY AMERICAS (“DBTCA”), and DEUTSCHE BANK AG NEW YORK BRANCH (“DBAGNY”, and together with DBTCA, the “Secured Parties”, and in its capacity as depositary bank with respect to the Account referred to below (the “Depositary Bank”)).

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REVOLVING CREDIT AGREEMENT Dated as of September 27, 2011 Among THE FINANCIAL INSTITUTIONS PARTY HERETO, as the Lenders, and CRÉDIT AGRICOLE CORPORATE AND INVESTMENT BANK, as Administrative Agent, and SUNPOWER CORPORATION, as Borrower
Revolving Credit Agreement • November 10th, 2011 • Sunpower Corp • Semiconductors & related devices • New York

This REVOLVING CREDIT AGREEMENT (this “Agreement”) dated as of September 27, 2011 is made by and among SunPower Corporation, a Delaware corporation (the “Borrower”), the financial institutions parties hereto from time to time (the “Lenders”), and Crédit Agricole Corporate and Investment Bank, as Administrative Agent (the “Agent”).

AMENDMENT NO. 4 TO INGOT SUPPLY AGREEMENT
Ingot Supply Agreement • November 10th, 2011 • Sunpower Corp • Semiconductors & related devices

THIS AMENDMENT NO. 4 INGOT SUPPLY AGREEMENT (This "Amendment No. 4") is made this 5th day of July 2011 ("Effective Date") by and between Woongjin Energy Co., Ltd., a company organized and existing under the laws of the Republic of Korea with its office located at 1316 GwanPyeong-Dong, YuSung-Gu, DaeJeon, Korea (“Supplier”), SunPower Corporation, a company organized under the laws of the State of Delaware, United States of America, with its principal office located at 3939 North First Street, San Jose, California 95134, United states of America (“SunPower”), and SunPower Philippines Manufacturing Limited, a Cayman Islands business and wholly owned subsidiary of SunPower, with a branch office at 100 East Main Avenue, Phase 4, Special Economic Zone, Laguna Techno Park, Binan, Laguna, Philippines 4024 (together with SunPower, “Purchaser”). Each of Supplier and Purchaser is sometimes referred to herein as a "Party" and collectively, as the "Parties". Capitalized terms used in this Amendment

CREDIT AGREEMENT Dated as of July 18, 2011 among SUNPOWER CORPORATION, as the Borrower, THE GUARANTORS PARTY HERETO, and UNION BANK, N.A., as the Lender
Credit Agreement • November 10th, 2011 • Sunpower Corp • Semiconductors & related devices • California

This CREDIT AGREEMENT is entered into as of July 18, 2011 among SUNPOWER CORPORATION, a Delaware corporation (the “Borrower”), the Guarantors (defined herein), and UNION BANK, N.A. (the “Lender”).

LETTER OF CREDIT FACILITY AGREEMENT dated as of August 9, 2011 among SUNPOWER CORPORATION, TOTAL S.A., the SUBSIDIARY APPLICANTS parties hereto from time to time, the BANKS parties hereto from time to time, and DEUTSCHE BANK AG NEW YORK BRANCH, as...
Letter of Credit Facility Agreement • November 10th, 2011 • Sunpower Corp • Semiconductors & related devices • New York

This LETTER OF CREDIT FACILITY AGREEMENT (this "Agreement"), dated as of August 9, 2011, is made by and among SunPower Corporation, a Delaware corporation (the "Company"), Total S.A., a société anonyme organized under the laws of the Republic of France (the “Parent Guarantor”), the Subsidiary Applicants parties hereto from time to time, the financial institutions parties hereto from time to time, and Deutsche Bank AG New York Branch, as Issuing Bank and as Administrative Agent.

CONTINUING AGREEMENT FOR STANDBY LETTERS OF CREDIT AND DEMAND GUARANTEES
Sunpower Corp • November 10th, 2011 • Semiconductors & related devices • New York

To induce each of you, in your sole discretion from time to time, to issue one or more irrevocable letters of credit or demand guarantees at the request of Applicant (as defined below), in substantially such form as Applicant shall request, Applicant unconditionally and irrevocably agrees with you, including as to each Credit (as defined below), as follows:

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