Re: Support Relating to SunPower LiquidityLetter Agreement • May 9th, 2017 • Sunpower Corp • Semiconductors & related devices • New York
This letter agreement (the “Letter Agreement”) is being entered into effective May 8, 2017 in connection with the discussions by and between Total S.A. (the “Parent”) and SunPower Corporation (the “Company”) in relation to up to US$100 million (the "Support Amount") of liquidity support that the Company has requested from Parent and that Parent is willing to provide in the form of a guaranty of the Company’s revolving credit agreement pursuant to the terms and conditions outlined herein.
