0000893220-04-002317 Sample Contracts

AutoNDA by SimpleDocs
AMONG AMKOR TECHNOLOGY, INC. AS BORROWER
Second Lien Credit Agreement • November 2nd, 2004 • Amkor Technology Inc • Semiconductors & related devices • New York
SECOND LIEN PLEDGE AND SECURITY AGREEMENT DATED AS OF OCTOBER 27, 2004
Second Lien Pledge and Security Agreement • November 2nd, 2004 • Amkor Technology Inc • Semiconductors & related devices • New York
GUARANTY SUPPLEMENT
Guaranty Supplement • November 2nd, 2004 • Amkor Technology Inc • Semiconductors & related devices

Each of the undersigned hereby agrees to be bound as a Guarantor for purposes of the Guaranty, dated as of June 29, 2004 (the "Guaranty"), among GUARDIAN ASSETS, INC. and certain other Subsidiaries of AMKOR TECHNOLOGY, INC. from time to time party thereto as Guarantors and acknowledged by CITICORP NORTH AMERICA, INC., as Administrative Agent, and each of the undersigned hereby acknowledges receipt of a copy of the Guaranty and the Credit Agreement. Each of the undersigned hereby represents and warrants that each of the representations and warranties contained in Section 16 (Representations and Warranties; Covenants) of the Guaranty applicable to it is true and correct on and as the date hereof as if made on and as of such date. Capitalized terms used herein but not defined herein are used with the meanings given them in the Guaranty.

Draft better contracts in just 5 minutes Get the weekly Law Insider newsletter packed with expert videos, webinars, ebooks, and more!