LOAN AGREEMENTLoan Agreement • November 21st, 2012 • Sanmina Corp • Printed circuit boards • New York
This LOAN AGREEMENT (as amended, restated, modified or otherwise supplemented from time to time, this “Agreement”) dated as of July 19, 2012, made by SANMINA-SCI CORPORATION, a Delaware corporation, having an address at 2700 North First Street, San Jose, California (“Borrower”), and UNION BANK, N.A., a national banking association, having an office at Technology, Media and Telecommunications Group, National Banking, 350 California Street 17th floor, San Francisco, CA 94104 (“Bank”).
LOAN, GUARANTY AND SECURITY AGREEMENTLoan, Guaranty and Security Agreement • November 21st, 2012 • Sanmina Corp • Printed circuit boards • New York
This Amendment No. 1 to the Amended and Restated Loan, Guaranty and Security Agreement (this “Amendment”), dated as of July 12, 2012, is made by SANMINA-SCI CORPORATION, a Delaware corporation (“Sanmina”), HADCO CORPORATION, a Massachusetts corporation (“Hadco”), HADCO SANTA CLARA, INC., a Delaware corporation (“Hadco Santa Clara”), SANMINA‑SCI SYSTEMS HOLDINGS, INC., a Delaware corporation (“SSCI Holdings”), SCI TECHNOLOGY, INC., an Alabama corporation (“SCI Technology”, and together with Sanmina, Hadco, Hadco Santa Clara, and SSCI Holdings, collectively, “Borrowers”), SANMINA-SCI SYSTEMS (CANADA) INC., a Nova Scotia limited company, and SCI BROCKVILLE CORP., a Nova Scotia unlimited company, each as a Designated Canadian Guarantor (as defined in the Amended and Restated Loan Agreement referred to below), the financial institutions listed on the signature pages hereof as Lenders, and BANK OF AMERICA, N.A., a national banking association, as agent for the Lenders (“Agent”).
