0000903423-03-000463 Sample Contracts

EXHIBIT 26 MEMC ELECTRONIC MATERIALS, INC. (a Delaware corporation) 22,000,000 Shares of Common Stock UNDERWRITING AGREEMENT Dated: May 15, 2003

Underwriting Agreement • May 22nd, 2003 • Memc Electronic Materials Inc • Semiconductors & related devices • New York

• Contract Type
  Underwriting Agreement
• Filed
  May 22nd, 2003
• Company
  Memc Electronic Materials Inc
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

EXHIBIT 27 LOCK-UP LETTER AGREEMENT LEHMAN BROTHERS INC. MERRILL LYNCH, PIERCE, FENNER & SMITH INCORPORATED SALOMON SMITH BARNEY INC. DEUTSCHE BANK SECURITIES INC. UBS WARBURG LLC As Representatives of the several Underwriters named in Schedule 1 to...

Lock-Up Letter Agreement • May 22nd, 2003 • Memc Electronic Materials Inc • Semiconductors & related devices

• Contract Type
  Lock-Up Letter Agreement
• Filed
  May 22nd, 2003
• Company
  Memc Electronic Materials Inc
• Industry
  Semiconductors & related devices

LEHMAN BROTHERS INC. MERRILL LYNCH, PIERCE, FENNER & SMITH INCORPORATED SALOMON SMITH BARNEY INC. DEUTSCHE BANK SECURITIES INC. UBS WARBURG LLC