Exhibit 29 ---------- MEMC ELECTRONIC MATERIALS, INC. (a Delaware corporation) 34,000,000 Shares of Common Stock UNDERWRITING AGREEMENT Dated: February 9, 2004Underwriting Agreement • February 17th, 2004 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Exhibit 30 ---------- LOCK-UP LETTER AGREEMENT Deutsche Bank Securities Inc. 60 Wall Street, 4th Floor New York, NY 10005 Dear Sirs: The undersigned understands that you propose to enter into an Underwriting Agreement (the "Underwriting Agreement")...Letter Agreement • February 17th, 2004 • Memc Electronic Materials Inc • Semiconductors & related devices
The undersigned understands that you propose to enter into an Underwriting Agreement (the "Underwriting Agreement") providing for the purchase by you (the "Underwriter") of shares (the "Shares") of Common Stock, par value $.01 per share (the "Common Stock"), of MEMC Electronic Materials, Inc., a Delaware corporation (the "Company"), and that the Underwriter proposes to reoffer the Shares to the public (the "Offering").
