CREDIT AGREEMENT Dated as of March 19, 2013 among RF MICRO DEVICES, INC., as the Borrower, THE SUBSIDIARIES OF THE BORROWER IDENTIFIED HEREIN, as the Guarantors, BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer, THE...Credit Agreement • March 25th, 2013 • Rf Micro Devices Inc • Semiconductors & related devices • New York
This CREDIT AGREEMENT is entered into as of March 19, 2013 among RF MICRO DEVICES, INC., a North Carolina corporation (the “Borrower”), the Guarantors (defined herein), the Lenders (defined herein) and BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer.
SECURITY AND PLEDGE AGREEMENTSecurity and Pledge Agreement • March 25th, 2013 • Rf Micro Devices Inc • Semiconductors & related devices
THIS SECURITY AND PLEDGE AGREEMENT (this “Agreement”) is entered into as of March 19, 2013 among RF MICRO DEVICES, INC., a North Carolina corporation (the “Borrower”), the other parties identified as “Obligors” on the signature pages hereto and such other parties that may become Obligors hereunder after the date hereof (together with the Borrower, individually an “Obligor”, and collectively the “Obligors”) and BANK OF AMERICA, N.A., in its capacity as administrative agent (in such capacity, the “Administrative Agent”) for the holders of the Secured Obligations (defined below).
