0000912057-01-543807 Sample Contracts

MODULE SUPPLIER AGREEMENT
Module Supplier Agreement • December 18th, 2001 • Suntek Corp • Wholesale-electronic parts & equipment, nec • Texas

This Module Supplier Agreement ("Agreement") dated February 2, 2000, is by and between Applied Materials, Inc., ("Applied"), a Delaware corporation, having places of business in Santa Clara, California and Austin, Texas and K*Tec Electronics Corporation ("Supplier") a Delaware corporation, having places of business in Sugar Land, Texas and Milpitas, California.

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LEASE AGREEMENT 1. BASIC PROVISIONS
1999 Lease Agreement • December 18th, 2001 • Suntek Corp • Wholesale-electronic parts & equipment, nec • Arizona
CREDIT AGREEMENT Dated as of January 26, 2001 among K*TEC ELECTRONICS CORPORATION and THE OTHER BORROWERS PARTY HERETO as Borrowers and THE LENDERS AND ISSUERS PARTY HERETO and CITICORP USA, INC. as Administrative Agent SALOMON SMITH BARNEY INC. as...
Credit Agreement • December 18th, 2001 • Suntek Corp • Wholesale-electronic parts & equipment, nec • New York

CREDIT AGREEMENT, dated as of January 26, 2001, among K*TEC Electronics Corporation, a Delaware corporation (together with any successor and permitted assigns, "K*TEC"), and each other Person that becomes a party hereto pursuant to Section 3.3 (Conditions Precedent to the Joinder of EFTC and EFTC Parent), the Lenders (as defined below), the Issuers (as defined below) and Citicorp USA, Inc. ("CUSA"), as agent for the Lenders and the Issuers (in such capacity, the "Administrative Agent").

AMENDMENT NO. 1 AND WAIVER TO K*TEC ELECTRONICS HOLDING CORPORATION CREDIT AGREEMENT, GUARANTY AND PLEDGE AND SECURITY AGREEMENT
Pledge and Security Agreement • December 18th, 2001 • Suntek Corp • Wholesale-electronic parts & equipment, nec • New York

AMENDMENT NO. 1 AND WAIVER (this "Amendment") dated as of November 7, 2001, among K*TEC Electronics Holding Corporation (formerly known as K*TEC Electronics Corporation), a Delaware Corporation (the "Borrower"), and Citicorp USA, Inc. as sole Lender (as defined below) and as Administrative Agent (as defined below), amends certain provisions of, and waives certain Events of Default under, the Credit Agreement dated as of January 26, 2001 (as amended to the date hereof, the "Credit Agreement") among the Borrower, the financial institutions from time to time party thereto as lenders (the "Lenders"), the financial institutions from time to time party thereto as issuers (the "Issuers") and Citicorp USA, Inc., as agent for the Lenders and Issuers (in such capacity, the "Administrative Agent"), the Guaranty and the Pledge and Security Agreement. Capitalized terms used herein but not defined herein are used as defined in the Credit Agreement.

EMPLOYMENT AGREEMENT
Employment Agreement • December 18th, 2001 • Suntek Corp • Wholesale-electronic parts & equipment, nec • Texas

THIS EMPLOYMENT AGREEMENT (this "Agreement") is entered into as of March 9, 2000 (the "Effective Date"), by and between K*TEC Electronics Corporation, a Delaware corporation (the "Company"), and Raymond M. Gibbons ("Employee").

FORM OF REGISTRATION RIGHTS AGREEMENT
Registration Rights Agreement • December 18th, 2001 • Suntek Corp • Wholesale-electronic parts & equipment, nec • New York

Registration Rights Agreement, dated as of , 200 , by and among Suntek Corporation, a Delaware corporation (the "Company"), Thayer-BLUM Funding, L.L.C. ("TBF"), and Thayer-BLUM Funding III, L.L.C. ("TBF III").

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