Proposed Form of Underwriting Agreement January [ ], 2002Underwriting Agreement • February 4th, 2002 • TTM Technologies Inc • Printed circuit boards • New York
Contract Type FiledFebruary 4th, 2002 Company Industry JurisdictionRobertson Stephens, Inc. [Other Co-Managers] as Representatives of the several Underwriters c/o Robertson Stephens, Inc. 555 California Street, Suite 2600 San Francisco, California 94104
SECOND AMENDMENT TO AMENDED AND RESTATED CREDIT AGREEMENTCredit Agreement • February 4th, 2002 • TTM Technologies Inc • Printed circuit boards
Contract Type FiledFebruary 4th, 2002 Company IndustryTHIS SECOND AMENDMENT TO AMENDED AND RESTATED CREDIT AGREEMENT (this "Amendment"), dated as of December 21, 2001, is by and among TTM TECHNOLOGIES, INC., a Washington corporation (the "Borrower"), each of those Domestic Subsidiaries of the Borrower identified as a "Guarantor" on the signature pages hereto (the "Guarantors"), the lenders identified on the signature pages hereto (collectively, the "Lenders"; and individually, a "Lender"), and FIRST UNION NATIONAL BANK, a national banking association, as administrative agent for the Lenders (in such capacity, the "Administrative Agent"). Capitalized terms used herein which are not defined herein and which are defined in the Existing Credit Agreement (defined below) shall have the same meanings as therein defined.