AGREEMENT AND PLAN OF MERGERDocument Agreement and Plan of Merger • April 22nd, 2002 • HPL Technologies Inc • Services-prepackaged software • Delaware
Contract Type FiledApril 22nd, 2002 Company Industry JurisdictionThis Agreement and Plan of Merger (the "Agreement") is entered into as of April 10, 2002 by and among HPL Technologies, Inc., a Delaware corporation ("HPL"), HPL Acquisition Sub, Inc., a Delaware corporation and wholly-owned subsidiary of HPL ("Merger Sub") and Defect & Yield Management, Inc., a Delaware corporation ("DYM").