QuickLinks -- Click here to rapidly navigate through this documentLoan and Security Agreement • October 15th, 2002 • Dpac Technologies Corp • Semiconductors & related devices • California
Contract Type FiledOctober 15th, 2002 Company Industry JurisdictionThis LOAN AND SECURITY AGREEMENT dated August 30, 2002 between SILICON VALLEY BANK ("Bank"), whose address is 3003 Tasman Drive, Santa Clara, California 95054 and DPAC TECHNOLOGIES CORP. ("Borrower"), whose address is 7321 Lincoln Way, Garden Grove, California 92841, provides the terms on which Bank will lend to Borrower and Borrower will repay Bank. The parties agree as follows: