0000912057-02-042180 Sample Contracts

TRIPATH TECHNOLOGY INC. LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • November 13th, 2002 • Tripath Technology Inc • Semiconductors & related devices • California

This LOAN AND SECURITY AGREEMENT is entered into as of July 12, 2002, by and between COMERICA BANK - CALIFORNIA (“Bank”) and TRIPATH TECHNOLOGY INC. (“Borrower”).

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FIRST AMENDMENT TO LOAN AND SECURITY AGREEMENT
Loan and Security Agreement • November 13th, 2002 • Tripath Technology Inc • Semiconductors & related devices

This First Amendment to Loan and Security Agreement is entered into as of August 23, 2002 (the “Amendment”), by and between COMERICA BANK – CALIFORNIA (“Bank”) and TRIPATH TECHNOLOGY INC. (“Borrower”).

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SUBLEASE AGREEMENT
Sublease Agreement • November 13th, 2002 • Tripath Technology Inc • Semiconductors & related devices
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INTELLECTUAL PROPERTY SECURITY AGREEMENT
Intellectual Property Security Agreement • November 13th, 2002 • Tripath Technology Inc • Semiconductors & related devices

This Intellectual Property Security Agreement is entered into as of July 12, 2002 by and between COMERICA BANK-CALIFORNIA (“Bank”) and TRIPATH TECHNOLOGY INC., a Delaware corporation (“Grantor”).

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