TRIPATH TECHNOLOGY INC. LOAN AND SECURITY AGREEMENTLoan Agreement • November 13th, 2002 • Tripath Technology Inc • Semiconductors & related devices • California
Contract Type FiledNovember 13th, 2002 Company Industry JurisdictionThis LOAN AND SECURITY AGREEMENT is entered into as of July 12, 2002, by and between COMERICA BANK - CALIFORNIA (“Bank”) and TRIPATH TECHNOLOGY INC. (“Borrower”).
FIRST AMENDMENT TO LOAN AND SECURITY AGREEMENTLoan and Security Agreement • November 13th, 2002 • Tripath Technology Inc • Semiconductors & related devices
Contract Type FiledNovember 13th, 2002 Company IndustryThis First Amendment to Loan and Security Agreement is entered into as of August 23, 2002 (the “Amendment”), by and between COMERICA BANK – CALIFORNIA (“Bank”) and TRIPATH TECHNOLOGY INC. (“Borrower”).
SUBLEASE AGREEMENTSublease Agreement • November 13th, 2002 • Tripath Technology Inc • Semiconductors & related devices
Contract Type FiledNovember 13th, 2002 Company Industry
INTELLECTUAL PROPERTY SECURITY AGREEMENTIntellectual Property Security Agreement • November 13th, 2002 • Tripath Technology Inc • Semiconductors & related devices
Contract Type FiledNovember 13th, 2002 Company IndustryThis Intellectual Property Security Agreement is entered into as of July 12, 2002 by and between COMERICA BANK-CALIFORNIA (“Bank”) and TRIPATH TECHNOLOGY INC., a Delaware corporation (“Grantor”).