TENDER AND SUPPORT AGREEMENTTender and Support Agreement • October 5th, 2010 • Ramius LLC • Semiconductors & related devices • Delaware
TENDER AND SUPPORT AGREEMENT (this “Agreement”) dated as of October 2, 2010 by and among MICROSEMI CORPORATION, a Delaware corporation (“Parent”), ARTFUL ACQUISITION CORP., a California corporation and wholly-owned subsidiary of Parent (“Purchaser”), and certain shareholders of ACTEL CORPORATION, a California corporation (the “Company”), listed on Annex I (each, a “Shareholder”).
AGREEMENT OF WAIVERWaiver Agreement • October 5th, 2010 • Ramius LLC • Semiconductors & related devices • California
This Agreement of Waiver (this “Waiver”) is entered into as of October 2, 2010 by and among Actel Corporation (the “Company”) and the entities and natural persons listed on Schedule A hereto (collectively, the “Ramius Group”).
JOINT FILING AGREEMENTJoint Filing Agreement • October 5th, 2010 • Ramius LLC • Semiconductors & related devices
In accordance with Rule 13d-1(k)(1)(iii) under the Securities Exchange Act of 1934, as amended, the persons named below agree to the joint filing on behalf of each of them of Amendment No. 6 to the Schedule 13D originally filed on October 14, 2008 (including additional amendments thereto) with respect to the shares of Common Stock, $0.001 par value, of Actel Corporation. This Joint Filing Agreement shall be filed as an Exhibit to such Statement.
