THIRD AMENDMENT TO LOAN AGREEMENTLoan Agreement • June 14th, 2007 • Global Innovation Corp. • Semiconductors & related devices • Texas
Contract Type FiledJune 14th, 2007 Company Industry JurisdictionThis THIRD AMENDMENT TO LOAN AGREEMENT (this "Third Amendment") is made as of the 31st day of May, 2007, by and among BEST CIRCUIT BOARDS, INC., a Texas corporation, and GLOBAL INNOVATION CORP., a Delaware corporation (collectively, the "Borrowers") and AMEGY BANK N.A., a national banking association ("Lender").
AMENDED AND RESTATED SUBORDINATION AGREEMENTSubordination Agreement • June 14th, 2007 • Global Innovation Corp. • Semiconductors & related devices • Texas
Contract Type FiledJune 14th, 2007 Company Industry JurisdictionTHIS AMENDED AND RESTATED SUBORDINATION AGREEMENT (this "Agreement") is entered into as of May 31, 2007, between BEST CIRCUIT BOARDS, INC., a Texas corporation ("Best"), and GLOBAL INNOVATION CORP., a Delaware corporation ("Global"; and together with Best, collectively, the "Borrower"), BRAD JACOBY ("Junior Lender") and AMEGY BANK N.A., a national banking association ("Senior Lender").