SEPARATION AGREEMENTSeparation Agreement • July 30th, 2002 • Ceva Inc • Semiconductors & related devices • Delaware
This Separation Agreement (this “Agreement”) is made and entered into as of , 2002, by and among DSP Group, Inc., a Delaware corporation (“DSPGI”), DSP Group Ltd., an Israeli corporation (“DSPGL”), Ceva, Inc., a Delaware corporation (“Ceva, Inc.”), DSP Ceva, Inc., a Delaware corporation (“DSP Ceva”), and Corage, Ltd., an Israeli corporation (“Corage, Ltd.”).
EMPLOYMENT AGREEMENTEmployment Agreement • July 30th, 2002 • Ceva Inc • Semiconductors & related devices
THIS EMPLOYMENT AGREEMENT (the “Agreement”), made this day of , 2002, is entered into by with its principal place of business at (the “Company”), and , residing at (the “Employee”).
AMENDMENT NO. 1 TO THE COMBINATION AGREEMENTCombination Agreement • July 30th, 2002 • Ceva Inc • Semiconductors & related devices
THIS AMENDMENT NO. 1, dated , 2002, amends the Combination Agreement (the “Agreement”) dated as of April 4, 2002, by and among Parthus Technologies plc, an Irish public limited company (“Parthus”), DSP Group, Inc., a Delaware corporation (“DSP Group”), and Ceva, Inc., a Delaware corporation and wholly-owned subsidiary of DSP Group (“Ceva”). Capitalized terms used herein and not otherwise defined shall have the meanings given to them in the Agreement.
