LOAN AGREEMENT BETWEEN KOPIN CORPORATION AND THE SUMITOMO BANK, LIMITEDLoan Agreement • May 12th, 1998 • Kopin Corp • Semiconductors & related devices
NOTELoan Agreement • May 12th, 1998 • Kopin Corp • Semiconductors & related devices
FOR VALUE RECEIVED, KOPIN CORPORATION, a Delaware corporation ("Borrower"), hereby promises to pay to the order of The Sumitomo Bank, Limited, a Japanese banking corporation ("Bank"), without counterclaim, offset or deduction, the principal sum of FIVE MILLION DOLLARS ($5,000,000) or, if less, the aggregate unpaid principal amount of all Disbursements (as defined in the Loan Agreement referred to below), in accordance with the terms of the Loan Agreement and to pay interest on the outstanding principal balance at the interest rates and at such times provided in the Loan Agreement and elected by Borrower and calculated in accordance with the terms of Loan Agreement. This Note is the Note referred to in the Loan Agreement, of even date herewith, between Borrower and Bank, and is subject to all of the terms and conditions of the Loan Agreement (which are incorporated herein by reference), including the rights of prepayment and the rights of acceleration of maturity. Terms used herein have
BACKGROUND ----------Restricted Account and Security Agreement • May 12th, 1998 • Kopin Corp • Semiconductors & related devices • New York
