0000930413-08-006669 Sample Contracts

DISTRIBUTORSHIP AGREEMENT
Distributor Agreement • November 14th, 2008 • Acl Semiconductor Inc • Wholesale-electronic parts & equipment, nec • Hong Kong

This Agreement is made and entered into this 1st day of March 2008, by and between SAMSUNG ELECTRONICS HONG KONG CO., LTD. a corporation duly organized and existing under the laws of the Hong Kong SAR with its place of business at Hong Kong 43/F-45/F, Two Int’l Finance Centre, 8 Finance Street, Central (hereinafter referred to as “SAMSUNG”) and ATLANTIC COMPONENTS LIMITED, a corporation duly organized and existing under the laws of HONG KONG with its principal place of business at B24-27, 1/F., BLOCK B, PROFICIENT INDUSTRIAL CENTRE, 6 WANG KWUN RD., KOWLOON BAY, KOWLOON (hereinafter referred to as “DISTRIBUTOR”)

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Banking Facilities: Atlantic Components Limited (“Borrower”)
Banking Facilities Agreement • November 14th, 2008 • Acl Semiconductor Inc • Wholesale-electronic parts & equipment, nec

We, DBS Bank (Hong Kong) Limited (“Bank”), refer to our letter dated 27 June 2006 together with the “Terms and Conditions Governing Banking Facilities and Services” attached therein setting out the facilities made available to you as varied by our letter dated 5 August 2006 (collectively called “the Existing Facility Letter”).

Banking Facilities: Atlantic Components Limited (“Borrower”)
Banking Facilities Agreement • November 14th, 2008 • Acl Semiconductor Inc • Wholesale-electronic parts & equipment, nec

We, DBS Bank (Hong Kong) Limited (“Bank”), refer to our letter dated 27 December 2006 together with the “Terms and Conditions Governing Banking Facilities and Services” and the “Terms and Conditions Governing Factoring Facilities and Services” attached therein setting out the facilities made available to you as varied by our letter dated 14 May 2007 (collectively called “the Existing Facility Letter”).

Banking Facilities: Atlantic Components Limited (“Borrower”)
Banking Facilities Agreement • November 14th, 2008 • Acl Semiconductor Inc • Wholesale-electronic parts & equipment, nec

We, DBS Bank (Hong Kong) Limited (“Bank”), refer to our letter dated 27 June 2006 together with the ‘‘Terms and Conditions Governing Banking Facilities and Services” attached therein setting out the facilities made available to you (collectively called “the Existing Facility Letter”).

CONFIDENTIAL Our Ref : WBG/06/4355 Date : 1 November 2006 Atlantic Components Limited B24-B27, 1/F., Block B, Proficient Industrial Centre, Kowloon Bay, Kowloon.
Facility Letter • November 14th, 2008 • Acl Semiconductor Inc • Wholesale-electronic parts & equipment, nec • Hong Kong

We, CITIC Ka Wah Bank Limited (the “Bank”), are pleased to offer you (the “Borrower”) the general banking facilities (the “Facilities”) on the following terms and conditions.

Date: 14 May 2007 Our ref: P/HIHI4/00413/07 Atlantic Components Limited B24-27, 1st Floor, Block B Proficient Industrial Centre
Banking Facilities Agreement • November 14th, 2008 • Acl Semiconductor Inc • Wholesale-electronic parts & equipment, nec

We, DBS Bank (Hong Kong) Limited (“Bank”), refer to our letter dated 27 December 2006 together with the “Terms and Conditions Governing Banking Facilities and Services” attached therein setting out the facilities made available to you (collectively called “the Existing Facility Letter”).

Banking Facilities
Facility Letter • November 14th, 2008 • Acl Semiconductor Inc • Wholesale-electronic parts & equipment, nec • Hong Kong

With reference to our recent discussions, we, Industrial and Commercial Bank of China (Asia) Limited (the “Bank”), are pleased to offer the following banking facilities to you (the “Borrower”), subject to the terms and conditions outlined below, the Bank’s General Agreement - General Banking Facilities (Form No. 110-1104C/0709/GH) and other agreements, availability of funds, periodic review, amendments and withdrawal at our sole and absolute discretion. You are advised to read and understand the terms and conditions, and seek independent legal advice, before accepting this Facility Letter.

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