SECOND AMENDED AND RESTATED CREDIT AGREEMENT Dated as of September 6, 2002Credit Agreement • November 12th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledNovember 12th, 2002 Company Industry JurisdictionWHEREAS, the Borrower and the TPG Lender (pursuant to a consummated assignment of all rights to them of the Initial Lender (as hereinafter defined)) are parties to an Amended and Restated Credit Agreement dated as of September 22, 2001 (the "Amended and Restated Credit Agreement");
INDEMNIFICATION AGREEMENTIndemnification Agreement • November 12th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • Delaware
Contract Type FiledNovember 12th, 2002 Company Industry JurisdictionThis Indemnification Agreement, dated as of ____________ ___, ______, is made by and between MEMC Electronic Materials, Inc., a Delaware corporation (the "Company"), and ________________________ (the "Indemnitee"), an "agent" (as hereinafter defined) of the Company.
FIRST AMENDMENT to the Technology Cooperation Agreement by and between Taisil Electronic Materials Corporation and MEMC Electronic Materials, Inc. dated October 26, 1994Technology Cooperation Agreement • November 12th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices
Contract Type FiledNovember 12th, 2002 Company Industry
Re: Amendment to Registration Rights Agreement Dear Rick:Registration Rights Agreement • November 12th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices
Contract Type FiledNovember 12th, 2002 Company IndustryReference is made to the Registration Rights Agreement (the "Agreement") dated as of November 13, 2001, by and between MEMC Electronic Materials, Inc., a Delaware corporation (the "Company"), the guarantors included on the signature lines thereto (the "Guarantors" and, together with the Company, the "Company Parties") and TPG Wafer Holdings LLC, a Delaware limited liability company (together with its permitted assigns, "TPG").
GUARANTY AGREEMENTGuaranty Agreement • November 12th, 2002 • Memc Electronic Materials Inc • Semiconductors & related devices • New York
Contract Type FiledNovember 12th, 2002 Company Industry JurisdictionGUARANTY AGREEMENT dated as of September 6, 2002, between MEMC ELECTRONIC MATERIALS, INC., a Delaware corporation ("MEMC" or the "Guarantor"), and TPG WAFER PARTNERS LLC, a Delaware limited liability company ("TPG Wafer"), as Agent and as the TPG Lender (as defined in the Credit Agreement referred to below).