SEPARATION AGREEMENT AND GENERAL RELEASESeparation Agreement and General Release • November 12th, 2003 • Memc Electronic Materials Inc • Semiconductors & related devices • Missouri
This Separation Agreement and General Release ("Agreement") is made and entered into by and between Jonathon P. Jansky ("Mr. Jansky") and MEMC Electronic Materials, Inc. ("MEMC"). In consideration of the following promises, the parties agree as follows:
MEMC Electronic Materials, Inc. 501 Pearl Drive (City of O'Fallon) Post Office Box 8 St. Peters, Missouri 63376 USA Phone: 636-474-5000 Fax: 636-474-5158 www.memc.comMemc Electronic • November 12th, 2003 • Memc Electronic Materials Inc • Semiconductors & related devices
Reference is made to the Registration Rights Agreement dated as of November 13, 2001, by and between MEMC Electronic Materials, Inc., a Delaware corporation (the "Company"), the guarantors included on the signature lines thereto (the "Guarantors" and, together with the Company, the "Company Parties") and TPG Wafer Holdings LLC, a Delaware limited liability company (together with its permitted assigns, "TPG"), as amended by letter agreements among the parties dated July 15, 2002, November 14, 2002 and February 17, 2003 (as amended, the "Agreement").
