0000945436-14-000023 Sample Contracts

CREDIT AGREEMENT

Credit Agreement • March 6th, 2014 • Sunedison, Inc. • Semiconductors & related devices • New York

• Contract Type
  Credit Agreement
• Filed
  March 6th, 2014
• Company
  Sunedison, Inc.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

PURCHASE AGREEMENT

Purchase Agreement • March 6th, 2014 • Sunedison, Inc. • Semiconductors & related devices • New York

• Contract Type
  Purchase Agreement
• Filed
  March 6th, 2014
• Company
  Sunedison, Inc.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

PLEDGE AND SECURITY AGREEMENT

Pledge and Security Agreement • March 6th, 2014 • Sunedison, Inc. • Semiconductors & related devices • New York

• Contract Type
  Pledge and Security Agreement
• Filed
  March 6th, 2014
• Company
  Sunedison, Inc.
• Industry
  Semiconductors & related devices
• Jurisdiction
  New York

This PLEDGE AND SECURITY AGREEMENT, dated as of December 20, 2013 (as it may be amended, restated, supplemented or otherwise modified from time to time, this “Agreement”), between SunEdison, Inc., a Delaware corporation (the “Borrower”) and each of the subsidiaries of the Borrower party hereto from time to time, whether as an original signatory hereto or as an Additional Grantor (as herein defined) (together with the Borrower, each, a “Grantor”), and Deutsche Bank AG New York Branch, as Administrative Agent (pursuant to and as defined in the Credit Agreement referred to below).