0000947871-18-000425 Sample Contracts

SUBSCRIPTION AGREEMENT
Subscription Agreement • May 18th, 2018 • Xinxin (Hong Kong) Capital Co., LTD • Semiconductors & related devices • Hong Kong
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SUBSCRIPTION AGREEMENT
Subscription Agreement • May 18th, 2018 • Xinxin (Hong Kong) Capital Co., LTD • Semiconductors & related devices
Sample 1Sample 2Sample 3
JOINT FILING AGREEMENT
Joint Filing Agreement • May 18th, 2018 • Xinxin (Hong Kong) Capital Co., LTD • Semiconductors & related devices

THIS JOINT FILING AGREEMENT is entered into as of May 18, 2018, by and among the parties hereto. The undersigned hereby agree that the Statement on Schedule 13D with respect to the common stock, par value US$0.004 per share, of Semiconductor Manufacturing International Corporation and any amendment thereto signed by each of the undersigned shall be filed on behalf of each undersigned pursuant to and in accordance with the provisions of Rule 13d-1(k)(1) under the Securities Exchange Act of 1934, as amended.

Sample 1
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