BETWEENJoint Venture Agreement • November 13th, 1996 • Semiconductor Packaging Materials Co Inc • Metal forgings & stampings
INTELLECTUAL PROPERTY LICENSE AGREEMENT THIS AGREEMENT, made as of this 28th day of August, 1996 by and between AMERICAN SILICON PRODUCTS, INC., a Rhode Island corporation ("Licensor") and INTERNATIONAL SEMICONDUCTOR PRODUCTS PTE LTD., a company...Intellectual Property License Agreement • November 13th, 1996 • Semiconductor Packaging Materials Co Inc • Metal forgings & stampings • New York
