Qimonda AG Registered no par value Ordinary Shares in the form of American Depositary Shares (each representing one Ordinary Share) or Ordinary Shares UNDERWRITING AGREEMENTUnderwriting Agreement • August 3rd, 2006 • Qimonda AG • Semiconductors & related devices • New York
Credit Suisse Securities (USA) LLC Citigroup Global Markets Inc. J.P. Morgan Securities Inc. As Representatives of the Several Underwriters listed in Schedule A hereto,
Qimonda AG Confidential Materials Omitted and Filed Separately with the Securities and Exchange Commission. Confidential Portions denoted by [***]. TESSERA, INC. Qimonda TCC ® License AgreementQimonda AG • August 3rd, 2006 • Semiconductors & related devices • California
This Agreement is entered into as of this First day of July, 2006 (“Effective Date”), between TESSERA INC., a corporation organized under the laws of Delaware, having a principal place of business at 3099 Orchard Drive, San Jose, CA, 95134, USA and the Tessera Affiliates (collectively “Tessera”) and Qimonda AG, a corporation organized under the laws of Germany having a principal place of business at Munich, Germany (or any successors or assigns of Qimonda AG due to any entities resulting from the initial public offering of Qimonda AG), and the Licensee Affiliates (collectively “Licensee”) with reference to the following facts:
Eleventh Amendment to License and Technical Cooperation Agreement dated 13 November 2002 and First Amendment to 60 nm Technical Cooperation Agreement dated 29 September 2005 This Agreement is entered into by and betweenQimonda AG • August 3rd, 2006 • Semiconductors & related devices
Nanya Technology Corporation, a company legally established under the laws of the Republic of China and having its head office at Hwa-Ya Technology Park 669, Fuhsing 3rd Road, Kueishan, Taoyuan, Taiwan, Republic of China (hereinafter “NTC”),
