LOAN AND SECURITY AGREEMENT by and among VIASYSTEMS TECHNOLOGIES CORP., L.L.C. MERIX CORPORATION as Borrowers and VIASYSTEMS, INC. VIASYSTEMS INTERNATIONAL, INC. MERIX ASIA, INC. as Guarantors THE LENDERS AND ISSUING BANK FROM TIME TO TIME PARTY...Loan and Security Agreement • February 22nd, 2010 • Merix Corp • Printed circuit boards • New York
This Loan and Security Agreement dated February 16, 2010 is entered into by and among Viasystems Technologies Corp., L.L.C., a Delaware limited liability company (“Technologies”), Merix Corporation, an Oregon corporation (“Merix” and, together with Technologies and any Subsidiaries that may become parties hereto after the date hereof as borrowers, each individually a “Borrower” and collectively, “Borrowers” as hereinafter further defined), Viasystems, Inc., a Delaware corporation (“Parent”), Viasystems International, Inc., a Delaware corporation (“International”), Merix Asia, Inc., an Oregon corporation (“Asia” and together with Parent and International and any Subsidiaries that may become parties hereto after the date hereof as guarantors, each individually a “Guarantor” and collectively, “Guarantors” as hereinafter further defined), the parties hereto from time to time as lenders, whether by execution of this Agreement or an Assignment and Acceptance (each individually, a “Lender” an
ContractSupplemental Indenture • February 22nd, 2010 • Merix Corp • Printed circuit boards • New York
First Supplemental Indenture (this “Supplemental Indenture”), dated as of February 22, 2010, among Merix Corporation (“Merix”), an Oregon corporation and a subsidiary of Viasystems, Inc. (or its permitted successor), a Delaware corporation (the “Company”), Merix Asia, Inc., an Oregon corporation and an indirect subsidiary of the Company (together with Merix, the “Guaranteeing Subsidiaries” and each a “Guaranteeing Subsidiary”), the Company, the other Guarantors (as defined in the Indenture referred to herein) and Wilmington Trust FSB, as trustee under the Indenture referred to below (the “Trustee”).
ContractSecond Supplemental Indenture • February 22nd, 2010 • Merix Corp • Printed circuit boards • New York
Second Supplemental Indenture (this “Supplemental Indenture”), dated as of February 22, 2010, among Viasystems Group, Inc. (the “Guaranteeing Parent”), a parent of Viasystems, Inc. (or its permitted successor), a Delaware corporation (the “Company”), the Company, the other Guarantors (as defined in the Indenture referred to herein) and Wilmington Trust FSB, as trustee under the Indenture referred to below (the “Trustee”).
