ContractCredit Facility Agreement • May 27th, 2010 • Amkor Technology Inc • Semiconductors & related devices
Contract Type FiledMay 27th, 2010 Company IndustryWoori Bank must explain the material contents hereof to the Borrower, and deliver the General Terms and Conditions for Bank Credit Transactions and a copy of this Credit Facility Agreement to the Borrower.
AMENDMENT AGREEMENT TO KUN-MORTGAGE AGREEMENT (For Changes of Scope of Secured Obligations & Settlement Date)Amendment Agreement to Kun-Mortgage Agreement • May 27th, 2010 • Amkor Technology Inc • Semiconductors & related devices
Contract Type FiledMay 27th, 2010 Company Industry* This amendment agreement is not required to be registered and becomes effective upon a mutual agreement by and among parties.
Additional AgreementCredit Facility Agreement • May 27th, 2010 • Amkor Technology Inc • Semiconductors & related devices
Contract Type FiledMay 27th, 2010 Company IndustryAs to the Credit Facility Agreement dated as of May 24, 2010 for a loan of 180,000,000 U.S. dollars (the “Credit Facility Agreement”), the parties to the Credit Facility Agreement hereby additionally agree to the following: