CREDIT AGREEMENT dated as of August 26, 2011, among SMART Modular Technologies (Global Memory Holdings), Inc., as Holdings, SMART Modular Technologies (Global), Inc., as Parent Borrower, SMART Modular Technologies, Inc., as Co- Borrower, The Lenders...Credit Agreement • March 3rd, 2017 • SMART Global Holdings, Inc. • Semiconductors & related devices • New York
CREDIT AGREEMENT dated as of August 26, 2011 (this “Agreement”), among SMART Modular Technologies (Global Memory Holdings), Inc., a Cayman Islands exempted company (“Holdings”), SMART Modular Technologies (Global), Inc., a Cayman Islands exempted company (the “Parent Borrower”), SMART Modular Technologies, Inc., California corporation (the “Co - Borrower” and, together with the Parent Borrower, the “Borrowers” and each a “Borrower”), the LENDERS party hereto and JPMORGAN CHASE BANK, N.A., as Administrative Agent.
SEVERANCE AND CHANGE OF CONTROL AGREEMENTSeverance and Change of Control Agreement • March 3rd, 2017 • SMART Global Holdings, Inc. • Semiconductors & related devices • California
SEVERANCE AND CHANGE OF CONTROL AGREEMENT (“Agreement”), dated as of December 10, 2010 (the “Effective Date”) by and between SMART Modular Technologies (WWH), Inc. (the “Company”), and Alan Marten (“Executive”).
EMPLOYMENT AGREEMENT Jack PachecoEmployment Agreement • March 3rd, 2017 • SMART Global Holdings, Inc. • Semiconductors & related devices • California
EMPLOYMENT AGREEMENT (the “Agreement”), dated as of October 10, 2011 (the “Effective Date”), by and between SMART Modular Technologies, Inc, a California corporation (the “Company”), and Jack Pacheco (“Executive” and, together with the Company, the “Parties” individually, a “Party”).
AMENDMENT NO. 1 TO CREDIT AGREEMENTCredit Agreement • March 3rd, 2017 • SMART Global Holdings, Inc. • Semiconductors & related devices • New York
This AMENDMENT NO. 1 TO CREDIT AGREEMENT (this “Amendment”), dated as of December 13, 2011, is made and entered into among SMART Modular Technologies (Global Memory Holdings), Inc., a Cayman Islands exempted company (“Holdings”), SMART Modular Technologies (Global), Inc., a Cayman Islands exempted company (the “Parent Borrower”), SMART Modular Technologies, Inc., California corporation (the “Co - Borrower” and, together with the Parent Borrower, the “Borrowers” and each a “Borrower”), the other Lenders party hereto and JPMorgan Chase Bank, N.A., as Administrative Agent (the “Administrative Agent”). Capitalized terms used and not otherwise defined herein shall have the meanings assigned to them in the Credit Agreement (as defined below).
ContractCredit Agreement • March 3rd, 2017 • SMART Global Holdings, Inc. • Semiconductors & related devices • New York
FIRST REFINANCING AMENDMENT dated as of August 20, 2014 (this “Amendment”), to the Credit Agreement (as defined below) among SMART Modular Technologies (Global Holdings), Inc. (f.k.a. SMART Modular Technologies (Global Memory Holdings), Inc.), as Holdings (“Holdings”), SMART Modular Technologies (Global), Inc., as Parent Borrower (the “Parent Borrower”), SMART Modular Technologies, Inc., as Co-Borrower (the “Co-Borrower”; together with the Parent Borrower, the “Borrowers”), the New Revolving Lenders (as defined below) party hereto and JPMorgan Chase Bank, N.A., as Administrative Agent.
