2D. Stockholders Agreement. The Company, Purchaser and each of the ---------------------- other stockholders of the Company listed therein will have entered into a stockholders agreement as set forth in Exhibit B attached hereto (the ---------...Stock Purchase Agreement • February 3rd, 2000 • Chippac LTD • Semiconductors & related devices • Delaware
Contract Type FiledFebruary 3rd, 2000 Company Industry Jurisdiction
EXHIBIT 10.19 EMPLOYMENT AGREEMENT This Agreement (the "Agreement") is made and entered into and is effective as of October 1, 1999, between ChipPAC, Inc., a California corporation (the "Company") and Dennis McKenna ("Executive"). This Agreement...Employment Agreement • February 3rd, 2000 • Chippac LTD • Semiconductors & related devices • California
Contract Type FiledFebruary 3rd, 2000 Company Industry Jurisdiction
EXHIBIT 10.13 Intel/ChipPAC Confidential CHIPPAC LIMITED and INTEL CORPORATION MATERIALS AGREEMENT This Agreement (the "Agreement") is entered into as of July 1, 1999 (the "Effective Date) by and between ChipPAC Limited, a British Virgin Islands...Materials Agreement • February 3rd, 2000 • Chippac LTD • Semiconductors & related devices • Delaware
Contract Type FiledFebruary 3rd, 2000 Company Industry Jurisdiction
July 15, 1999Chippac LTD • February 3rd, 2000 • Semiconductors & related devices
Company FiledFebruary 3rd, 2000 IndustryRe: TCC License Agreement dated December 22, 1998, as amended between Tessera, Inc. and the Tessera Affiliates and ChipPAC, Inc. and the Licensee Affiliates (the "Agreement")
Exhibit 10.11 ------------- PATENT SUBLICENSE AGREEMENT --------------------------- THIS PATENT SUBLICENSE AGREEMENT (the "Agreement") is entered into as of the Effective Time by and between Hyundai Electronics Industries Co., Ltd., Hyundai Jeonja...Patent Sublicense Agreement • February 3rd, 2000 • Chippac LTD • Semiconductors & related devices • Illinois
Contract Type FiledFebruary 3rd, 2000 Company Industry Jurisdiction