CHIPPAC, INC., as Company ST ASSEMBLY TEST SERVICES LTD, as Parent and FIRST SUPPLEMENTAL INDENTURE TO THE INDENTURE DATED AS OF MAY 28, 2003 Dated as of August 4, 2004First Supplemental Indenture • October 13th, 2004 • Chippac Inc • Semiconductors & related devices • New York
FIRST SUPPLEMENTAL INDENTURE (this “First Supplemental Indenture”), dated as of August 4, 2004, between ChipPAC, Inc., a corporation duly organized and existing under the laws of the State of Delaware (the “Company”), ST Assembly Test Services Ltd, a Singapore public company limited by shares (the “Parent”) and U.S. Bank National Association, a banking association duly organized and existing under the laws of the United States of America, as trustee (the “Trustee”).
STATS ChipPAC Ltd. 10 Ang Mo Kio Street 65 #05-17/20 Techpoint Singapore 569059Deposit Agreement • October 13th, 2004 • Chippac Inc • Semiconductors & related devices • New York
